Additive Manufacturing in Semiconductor Packaging: The Operational Plan of XTPL and Manz Asia
XTPL and Manz Asia collaborate to integrate Ultra-Precise Dispensing (UPD) technology into semiconductor advanced packaging processes. Thanks to this partnership, XTPL can scale the adoption of its solution without infrastructure investments, entering the Taiwanese market through a technological demonstrator. UPD technology enables sub-micron depositions of materials c










