Manufacturing Automation of build preparation in additive manufacturing reduces errors and time through standardized and repeatable processes. Solutions like AMIS Runtime enable intelligent nesting and continuous optimization, increasing density and production flexibility. Benefits include fewer human errors, greater machine efficiency, and cost reduction. Integration requires val
Manufacturing Post-processing and debinding are crucial stages in additive manufacturing that determine the quality, strength, and finish of components. Technologies such as vapor smoothing and chemical debinding improve surface and structural properties, making parts ready for industrial use.
Manufacturing In 2025-26, 3D printing moves beyond experimentation: aerospace, medical, automotive, and defense integrate it into main lines, driven by investments, geopolitics, and reliable standards. Market from 40 to 250 billion by 2035: those who train and scale now will lead the manufacturing of the future.
Innovations Carnegie Mellon leads the $28.5 million LIVE project to print temporary liver tissue: a “biological bridge” that supports the liver in regeneration, avoids transplantation, and reduces waiting lists within 5 years.
Manufacturing In 2025, additive manufacturing of metals and ceramics enters industrial production: DED heads without chamber, LFAM for large structures, 3D ceramics for medtech and semiconductors.
Manufacturing Multi-material 3D printing: a single part with rigid, flexible, conductive zones. Innovations from Bambu to Stratasys, automotive-aerospace applications, open-source software, and US investments toward mass production.
Manufacturing 3D printing is revolutionizing orthopedic implants: metal-free ceramic materials, customized anatomy, controlled porosity, and in-hospital production for reduced time and costs.
Manufacturing New Metal X and Gauss MT90 technologies eliminate direct metal dust management, reducing risks and infrastructure costs in additive manufacturing.
Manufacturing 3D metal printing: Gauss MT90 safe and compact, new Al alloys, holographic lithography for chips, automated Meshy workflow, recognition by USA as critical infrastructure.